YILDIZ, F. Et Al. 2015. CMUT PACKAGING FOR FORWARD LOOKING ULTRASONICENDOSCOPE USING LTCC SIDE VIA. The 32nd SENSOR SYMPOSIUM on Sensors,Micromachines and Applied Systems , (Niigata, Japan).

YILDIZ, F., Matsunaga, T., & Haga, Y., (2015). CMUT PACKAGING FOR FORWARD LOOKING ULTRASONICENDOSCOPE USING LTCC SIDE VIA . The 32nd SENSOR SYMPOSIUM on Sensors,Micromachines and Applied Systems, Niigata, Japan

YILDIZ, FİKRET, Tadao Matsunaga, And Yoichi Haga. "CMUT PACKAGING FOR FORWARD LOOKING ULTRASONICENDOSCOPE USING LTCC SIDE VIA," The 32nd SENSOR SYMPOSIUM on Sensors,Micromachines and Applied Systems, Niigata, Japan, 2015

YILDIZ, FİKRET Et Al. "CMUT PACKAGING FOR FORWARD LOOKING ULTRASONICENDOSCOPE USING LTCC SIDE VIA." The 32nd SENSOR SYMPOSIUM on Sensors,Micromachines and Applied Systems , Niigata, Japan, 2015

YILDIZ, F. Matsunaga, T. And Haga, Y. (2015) . "CMUT PACKAGING FOR FORWARD LOOKING ULTRASONICENDOSCOPE USING LTCC SIDE VIA." The 32nd SENSOR SYMPOSIUM on Sensors,Micromachines and Applied Systems , Niigata, Japan.

@conferencepaper{conferencepaper, author={FİKRET YILDIZ Et Al. }, title={CMUT PACKAGING FOR FORWARD LOOKING ULTRASONICENDOSCOPE USING LTCC SIDE VIA}, congress name={The 32nd SENSOR SYMPOSIUM on Sensors,Micromachines and Applied Systems}, city={Niigata}, country={Japan}, year={2015}}