EVCİN BAYDİLLİ, E. 2024. The effect of Cu-doping to the DLC interlayer on the temperature dependent current-conduction mechanisms and barrier shape of the Schottky devices. Materials Science in Semiconductor Processing , vol.184 .

EVCİN BAYDİLLİ, E., (2024). The effect of Cu-doping to the DLC interlayer on the temperature dependent current-conduction mechanisms and barrier shape of the Schottky devices. Materials Science in Semiconductor Processing , vol.184.

EVCİN BAYDİLLİ, ESRA. "The effect of Cu-doping to the DLC interlayer on the temperature dependent current-conduction mechanisms and barrier shape of the Schottky devices," Materials Science in Semiconductor Processing , vol.184, 2024

EVCİN BAYDİLLİ, ESRA E. . "The effect of Cu-doping to the DLC interlayer on the temperature dependent current-conduction mechanisms and barrier shape of the Schottky devices." Materials Science in Semiconductor Processing , vol.184, 2024

EVCİN BAYDİLLİ, E. (2024) . "The effect of Cu-doping to the DLC interlayer on the temperature dependent current-conduction mechanisms and barrier shape of the Schottky devices." Materials Science in Semiconductor Processing , vol.184.

@article{article, author={ESRA EVCİN BAYDİLLİ}, title={The effect of Cu-doping to the DLC interlayer on the temperature dependent current-conduction mechanisms and barrier shape of the Schottky devices}, journal={Materials Science in Semiconductor Processing}, year=2024}