YILDIZ, F. Et Al. 2016. Capacitive Micromachined Ultrasonic Transducer Packaging for Forward looking Ultrasonic Endoscope using Low Temperature Co fired Ceramic Side Via. IEEJ TRANSACTIONS ON SENSORS AND MICROMACHINES , vol.136, no.12 , 515-521.

YILDIZ, F., Matsunaga, T., & Haga, Y., (2016). Capacitive Micromachined Ultrasonic Transducer Packaging for Forward looking Ultrasonic Endoscope using Low Temperature Co fired Ceramic Side Via. IEEJ TRANSACTIONS ON SENSORS AND MICROMACHINES , vol.136, no.12, 515-521.

YILDIZ, FİKRET, Tadao Matsunaga, And Yoichi Haga. "Capacitive Micromachined Ultrasonic Transducer Packaging for Forward looking Ultrasonic Endoscope using Low Temperature Co fired Ceramic Side Via," IEEJ TRANSACTIONS ON SENSORS AND MICROMACHINES , vol.136, no.12, 515-521, 2016

YILDIZ, FİKRET Et Al. "Capacitive Micromachined Ultrasonic Transducer Packaging for Forward looking Ultrasonic Endoscope using Low Temperature Co fired Ceramic Side Via." IEEJ TRANSACTIONS ON SENSORS AND MICROMACHINES , vol.136, no.12, pp.515-521, 2016

YILDIZ, F. Matsunaga, T. And Haga, Y. (2016) . "Capacitive Micromachined Ultrasonic Transducer Packaging for Forward looking Ultrasonic Endoscope using Low Temperature Co fired Ceramic Side Via." IEEJ TRANSACTIONS ON SENSORS AND MICROMACHINES , vol.136, no.12, pp.515-521.

@article{article, author={FİKRET YILDIZ Et Al. }, title={Capacitive Micromachined Ultrasonic Transducer Packaging for Forward looking Ultrasonic Endoscope using Low Temperature Co fired Ceramic Side Via}, journal={IEEJ TRANSACTIONS ON SENSORS AND MICROMACHINES}, year=2016, pages={515-521} }