Capacitive micromachined ultrasonic transducer: transmission performance evaluation under different driving parameters and membrane stress for underwater imaging applications


Yaşar A. İ., YILDIZ F., Eroğul O.

Microsystem Technologies, cilt.26, sa.12, ss.3601-3611, 2020 (SCI-Expanded) identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 26 Sayı: 12
  • Basım Tarihi: 2020
  • Doi Numarası: 10.1007/s00542-020-04827-4
  • Dergi Adı: Microsystem Technologies
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, PASCAL, Applied Science & Technology Source, Compendex, Computer & Applied Sciences, INSPEC
  • Sayfa Sayıları: ss.3601-3611
  • Hakkari Üniversitesi Adresli: Evet

Özet

Transmission performance of a CMUT element in terms of output pressure and displacements was evaluated. A SIMULINK model of single CMUT element based on mechanical model of MEMS capacitor was used and the analyses were performed under different ac and dc conditions. 2.6 µm thick Si, Poly-Si and Si3Ni4 membranes with a radius 60 µm were used to obtain results for underwater imaging application. Relation between membrane stress and outputs of CMUT was also investigated using SIMULINK model for commonly used CMUT membrane made of Si3Ni4 and polysilicon membrane under different electrical driving parameters. It was observed that different ac signal inputs (sine, square and sawtooth) showed different effects on CMUTs pressure and displacement characteristics. Our results indicated that the maximum output pressure and displacement were obtained in a square waveform. In addition, although stress on membrane increases the displacement and pressure of CMUT membrane made of Poly-Si, quality factor inversely proportional to stress on membrane. Membrane stress has adverse effect on Si3Ni4 membrane transmission outputs. The used model in this study might enable to determine optimum driving electrical inputs and stress on membrane to control CMUT outputs in terms of output pressure, displacement, quality factor and bandwitdh.