Anodically bondable Low Temperature Co-Fired Ceramic (LTCC) based Fabry-Pérot Interferometer (FPI) pressure sensor design


Optik, vol.247, 2021 (SCI-Expanded) identifier

  • Publication Type: Article / Article
  • Volume: 247
  • Publication Date: 2021
  • Doi Number: 10.1016/j.ijleo.2021.167755
  • Journal Name: Optik
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, Aerospace Database, Communication Abstracts, INSPEC
  • Keywords: Bonding stress, FPI, Frequency response, LTCC, Q factor
  • Hakkari University Affiliated: Yes


In this study, effect of anodic bonding temperature on the sensitivity, frequency response, Q factor and frequency bandwidth of Fabry–Pérot Interferometer (FPI) pressure sensor was studied by considering anodically bonded low temperature cofired ceramic (LTCC)-Si substrates. Using LTCC subsrate rather than glass for FPI pressure sensor fabrication makes this study different from the available studies in the literature. Four sensors design were studied under different bonding temperature between the 320 °C − 520 °C. Thickness of Si diaphragms were 5 μm, 10 μm, 15 μm and 20 μm with the radius of 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, respectively. It was found that the sensitivity, frequency response and Q factors were influced by anodic bonding temperature induced stress on Si diaphragms although frequency bandwidth is not correlated with the bonding temperature induced stress. In this study, it was concluded that anodic bonding temperature is a useful parameter for tuning the sensitivity, frequency response and Q factor of micro electro-mechanical system (MEMS) based FPI pressure sensor.