Yayınlar & Eserler

SCI, SSCI ve AHCI İndekslerine Giren Dergilerde Yayınlanan Makaleler

Diğer Dergilerde Yayınlanan Makaleler

Hakemli Kongre / Sempozyum Bildiri Kitaplarında Yer Alan Yayınlar

Evaluation of CMUT Performance under Different Excitation Signals and Electrode Coverage

11th International Conference on Electrical and Electronics Engineering, ELECO 2019, Bursa, Türkiye, 28 - 30 Kasım 2019, ss.441-444 identifier

Investigation of Different Membrane Materials Effects in CMUT Membrane Behaviour

3rd International Symposium on Multidisciplinary Studies and Innovative Technologies, ISMSIT 2019, Ankara, Türkiye, 11 - 13 Ekim 2019 identifier

Capacitive Micromachined Ultrasonic Transducer (CMUT) with Different Insulation Layer Size

International Congress on Human-Computer Interaction, Optimization and Robotic Applications, 5 - 07 Temmuz 2019

Custom Design Fruit Quality Evaluation System with Non-Destructive Testing (NDT) Techniques

2018 International Conference on Artificial Intelligence and Data Processing, IDAP 2018, Malatya, Türkiye, 28 - 30 Eylül 2018 identifier

Image processing based machine vision system for tomato volume estimation

4th Electric Electronics, Computer Science, Biomedical Engineerings' Meeting, EBBT 2018, İstanbul, Türkiye, 18 - 19 Nisan 2018, ss.1-4 identifier

MEMS based CMUT Packaging Technology

International Engineering and Technology Symposium, 03 Mayıs 2018

Examination of Stress Level of Patients During Needle Related Invasive Applications

IV. International Multidisciplinary Eurasian Congress, Roma, İtalya, 23 - 25 Ağustos 2017, ss.140-141

Low Temperature Co-Fired Ceramic for CapacitiveMicromachined Ultrasonic Transducer Fabrication

Internationla Materials Technologies and Metallurgy Conference, 26 Ekim - 27 Aralık 2017

Capacitive Micromachined Ultrasonic Transducer (CMUT) Technology: Fabrication and Application(s)

International Congress on New Trends in Science ,Engineering and Technology (ICONTRENDS ’17 / BARCELONA), Barcelona, İspanya, 27 - 29 Nisan 2017

CMUT arrays incorporating anodically bondable LTCC for small diameter ultrasonic endoscope

2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Sendai, Japan, 17 - 20 Nisan 2016 identifier

CMUT PACKAGING FOR FORWARD LOOKING ULTRASONICENDOSCOPE USING LTCC SIDE VIA

The 32nd SENSOR SYMPOSIUM on Sensors,Micromachines and Applied Systems, Niigata, Japonya, 28 - 30 Ekim 2015

Metrikler

Yayın

34

Atıf (Scopus)

92

H-İndeks (Scopus)

6

Atıf (TrDizin)

5

H-İndeks (TrDizin)

1

Proje

3

Tez Danışmanlığı

2

Açık Erişim

3
BM Sürdürülebilir Kalkınma Amaçları